Chip packages

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surface mount

  • SO/SOIC: largest surface mount available, has wings (0.05 inch / 1.27 mm pitch)
    • SO14: 8.5mm x 6mm including pins
  • SSOP: smaller than SO, but still has wings (0.65mm pitch)
    • SSOP14: 6mm x 7.8mm including pins
  • TSSOP: thinner, smaller SSOP (0.65mm pitch)
    • TSSOP14: 5mm x 6.4mm including pins
  • DHVQFN: leadless; center ground; plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
    • DHVQFN14: 3mm x 2.5mm

references

http://howto.wikia.com/wiki/Howto_identify_chip_packages

http://www.intersil.com/design/packages/

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